BAKU 858 HOT AIR SOLDER STATION

BAKU 858 HOT AIR SOLDER STATION

Features:

1. Brushless fan and low noise.
2. Large and soft air flow.
3. Constant Temperature-control.
4. Automatic cooling, delay power, protect heating core.
5. Safety to prevent accidents.

Application:

• Suitable for unsoldering multiple components, such as SOIC, CHIP, QFP, PLCC and BGA.
• Applicable for hot contraction, heating, painting-removing, glue-removing, defrosting, preheating.
• For MacBook, Cellular phones, PDAs, handhelds, laptops, notebooks, and motherboard repairs.